Published May 27, 2013
The School of Architecture and Planning is excited to report on the first meeting of the “Buffalo in…” series, a new program to build connections among alumni and engage our graduates in the energy and growth of our school. Taking place in New York on May 15, the gathering brought together distinguished alumni from the New York City area to further define the program’s schedule for the upcoming year.
The tentative “Buffalo in New York” program will feature three annual gatherings focused around lectures, recruitment and networking. The first event, a continuing education lecture or seminar, will engage alumni and professional partners around critical topics in architecture and planning. A second event focused on professional recruiting will bring potential employers and current students together to connect the best and brightest in our school with top firms in the region. The final event will link alumni with prospective students through a series of tours, meetings with faculty and dialogue about the School of Architecture and Planning. The “Buffalo in…” series will also connect with the UB Career Services BullsEye Network to build alumni-to-student mentoring.
The Buffalo in New York event capped off with a cocktail reception with UB President Satish K. Tripathi, who completed his “20+ cities in 20 months” tour with a gathering with alumni and friends from around the world.
As the school continues to lay the groundwork for the “Buffalo in…” series, Dean Robert Shibley invites alumni to get involved: “In heading off this program in New York, our hope is to foster a new era of connection, collaboration and community among all who enrich the fabric of the School of Architecture and Planning. Join us as we explore new frontiers for our school and the disciplines of architecture and planning.”
Interested in learning more or leading a “Buffalo in…” series in your own city? Contact us today at: email@example.com or reach out to Subbiah Mantharam, Associate Dean for External Affairs, at 716-829-3793.